JPH0515728Y2 - - Google Patents
Info
- Publication number
- JPH0515728Y2 JPH0515728Y2 JP14437187U JP14437187U JPH0515728Y2 JP H0515728 Y2 JPH0515728 Y2 JP H0515728Y2 JP 14437187 U JP14437187 U JP 14437187U JP 14437187 U JP14437187 U JP 14437187U JP H0515728 Y2 JPH0515728 Y2 JP H0515728Y2
- Authority
- JP
- Japan
- Prior art keywords
- module
- sheet
- lead wire
- grounding
- washer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 230000007613 environmental effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000271 Kevlar® Polymers 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14437187U JPH0515728Y2 (en]) | 1987-09-24 | 1987-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14437187U JPH0515728Y2 (en]) | 1987-09-24 | 1987-09-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6451267U JPS6451267U (en]) | 1989-03-29 |
| JPH0515728Y2 true JPH0515728Y2 (en]) | 1993-04-26 |
Family
ID=31412022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14437187U Expired - Lifetime JPH0515728Y2 (en]) | 1987-09-24 | 1987-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0515728Y2 (en]) |
-
1987
- 1987-09-24 JP JP14437187U patent/JPH0515728Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6451267U (en]) | 1989-03-29 |
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